GaAs MMIC packages,low cost,surface mount packaging technology for high frequency mmwave applications,DC to 40 GHz,

RF Microwave And Wireless Communication Products
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VIA/PAKTM Ball Grid Array (VBGA) Packages for GaAs MMICs From

Micro Substrates Corporation and HD Communications

MSC's VBGA is an important break through in achieving a true surface-mount packaging solution for high-frequency MMICs. The solution is achieved at an attractive performance/price ratio for the cost-sensitive, commercial wireless market. VBGA packages are manufactured using semiconductor fabrication techniques to achieve the cost advantages of array processing. VIA/PLANE TM, a single layer, ceramic interconnect substrate with tungsten-copper through vias, is the base material for these packages. The balls are brazed to the package using Cu-Ag eutectic alloy. This thin-film, ceramic, surface-mount, VBGA package is developed for applications such as VSAT terminals, point-to-point radio, LMDS, and phased array communication satellites covering a frequency range of DC - 31.5 GHz.

A higher frequency VBGA package for 30 - 45 GHz range is currently under development.

Completed VBGA Assembly Cross Section

The VBGA ceramic substrate is 99.6% alumina, and the high-frequency RF ports are made of specially designed tungsten-copper vias. Additionally, aluminum nitride VBGA ia available for power devices such as power amplifiers. Low-inductance vias, tight impedance control through thin-film process techniques and the elimination of leads ensure high-frequency performance of the package. In addition, ground and DC connections are provided through the tungsten-copper, low-inductance vias, which also ensure good thermal performance. Cu-Ag balls, 0.125mm to 0.25mm high, are the input/output interface to the PC board. Ceramic or plastic lid with epoxy preform can be used for enclosing the MMIC.

An outstanding feature of the VBGA is its high degree of flatness to match the IC. This is critical to achieving high assembly yields, especially for flip chips and thin GaAs ICs such as power amplifiers.

Comparison of the VBGA with other Microstrip type Packages

FEATURE

VBGA

MICROSTRIP/ STRIPLINE

Configuration

Through-vias, surface mountable
Ribbon bonded

PCB Space

Same as package
1.3 x package size

Wire-Bond

Only MMIC is wire bonded
2-3 sets of bonds; device to package, package to PCB

Reliability

No Leads
Ribbon-bonded

MANFACTURE

    Manufacturability

Easy reflow assembly
Wire bonding on soft PC board poses yield problems

    Flip Chip

Excellent compatibility, eliminates wire bonds
Incompatible

    Embedded Passives

Can be integrated into VBGA*
Cannot be integrated, second level board required

    Assemby

Self-aligning on reflow, low cost
Several ribbons, tolerances add up, low yield

    System Intergration

Packaged MMIC is a Known Good Die
Not Applicable

    Volume

Automated pick-and-place compatibility
Not Applicable

    Reworkability

Easily replaced
Difficult

Standard off the shelf package

Part # 1MSC625B    DC-31.5 GHz VBGA

Part # 1MSC625B Specifications

Overall package size 0.250" square

Ceramic 99.6% alumina

I/Os 3 DC to 31.5 GHz & 5 DC to 6 GHz

Balls Cu/Ag brazed to ceramic, nickel/gold plated

Die side metallization Ti, Ni and Au: wire bondable

Die attach area, excluding fillet 0.078"

Die attach options epoxy solder, Au-Sn, Au-Ge, and other gold alloys

Vias tungsten-copper solid vias

Via thermal conductivity 200 W/m K, approximately

Lid (optional) pressed ceramic or plastic lid with epoxy preform

Package dissipation 1.5 - 2 watts

Package temperature limit maximum 420 degrees C in nitrogen for 5 minutes

Package attachment method automated solder reflow or epoxy

Thermal Shock

MIL-STD-883, method 1100.9, Condition C

Ball Shear Strenght 1 kg, minimum

Part # 1MSC625B Performance Chart

Graphics & photo © of Micro Substrates Corporation 1998, All Rights Reserved

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	VIA/PAKTM Ball Grid Array (VBGA) Packages for GaAs MMICs From Micro Substrates Corporation and HD Communications MSC's VBGA is an important break through in achieving a true surface-mount packaging solution for high-frequency MMICs. The solution is achieved at an attractive performance/price ratio for the cost-sensitive, commercial wireless market. VBGA packages are manufactured using semiconductor fabrication techniques to achieve the cost advantages of array processing. VIA/PLANE TM, a single layer, ceramic interconnect substrate with tungsten-copper through vias, is the base material for these packages. The balls are brazed to the package using Cu-Ag eutectic alloy. This thin-film, ceramic, surface-mount, VBGA package is developed for applications such as VSAT terminals, point-to-point radio, LMDS, and phased array communication satellites covering a frequency range of DC - 31.5 GHz. A higher frequency VBGA package for 30 - 45 GHz range is currently under development.



				Completed VBGA Assembly Cross Section

	The VBGA ceramic substrate is 99.6% alumina, and the high-frequency RF ports are made of specially designed tungsten-copper vias. Additionally, aluminum nitride VBGA ia available for power devices such as power amplifiers. Low-inductance vias, tight impedance control through thin-film process techniques and the elimination of leads ensure high-frequency performance of the package. In addition, ground and DC connections are provided through the tungsten-copper, low-inductance vias, which also ensure good thermal performance. Cu-Ag balls, 0.125mm to 0.25mm high, are the input/output interface to the PC board. Ceramic or plastic lid with epoxy preform can be used for enclosing the MMIC. An outstanding feature of the VBGA is its high degree of flatness to match the IC. This is critical to achieving high assembly yields, especially for flip chips and thin GaAs ICs such as power amplifiers.